EFFECTS OF SMALL ADDITIONS OF COPPER ON THE RECRYSTALLIZATION OF ALUMINUM PURIFIED BY ZONE MELTING (in French)
Journal Article
·
· Compt. rend.
OSTI ID:4240410
A study of the recrystallization of very pure Al and Al alloys containing very small amounts of Cu is described. The Al purified by zone melting contained only about 10 ppm impurities; the amounts of Cu added (0.36 to 120 ppm) were controlled by activation analysis. The samples were rolled in liquid N/sub 2/ to a 97% reduction, then isothermally annealed for increasing times at temperatures from --38 to +87 deg C. After electrolytic polishing and anodic oxidation at low temperature, they were micrographed in polarized light. The electric resistivity at liquid H/sub 2/ temperatures was measured during the recrystallization anneals. The Cu effect was very different for germination and for growth of new grains in the interior of the cold-worked metal. The intervention of a restoration phenomenon for samples containing 5 to 120 ppm Cu was observed which is not found in pure Al. (T.R.H.)
- Research Organization:
- Originating Research Org. not identified
- NSA Number:
- NSA-13-018146
- OSTI ID:
- 4240410
- Journal Information:
- Compt. rend., Journal Name: Compt. rend. Vol. Vol: 249
- Country of Publication:
- Country unknown/Code not available
- Language:
- French
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