Planar surface-micromachined pressure sensors by chemical-mechanical polishing
- New Mexico Univ., Albuquerque, NM (United States). Center for High Technology Materials
- Sandia National Labs., Albuquerque, NM (United States)
Planar, surface micromachined pressure sensors have been fabricated by an extension of the chemical-mechanical polishing (CMP) process. CMP eliminates many of the fabrication problems associated with the photolithography, dry etch, and metallization of non-planar devices. Furthermore, CMP adds additional design flexibility. The sensors are based upon deformable, silicon nitride diaphragms with polysilicon piezoresistors. Absolute pressure is detected by virtue of reference pressure cavities underneath the diaphragms.
- Research Organization:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 403993
- Report Number(s):
- SAND-96-2280C; CONF-9609271-1; ON: DE96014887
- Resource Relation:
- Conference: 3. micromachining workshop, Anaheim, CA (United States), 25-26 Sep 1996; Other Information: PBD: [1996]
- Country of Publication:
- United States
- Language:
- English
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