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ELECTRON BOMBARDMENT DAMAGE IN SILICON ESAKI DIODES

Journal Article · · Journal of Applied Physics (U.S.)
DOI:https://doi.org/10.1063/1.1736205· OSTI ID:4018727
The excess current in silicon Esaki diodes was shown to be a sensitive indicator of the density and distribution of states introduced into the forbidden gap by electron bombardment. Both the effects of bombardment and the annealing properties of the radiation damage were found to depend upon the specific donor in the n-type region of the diode. The average bombardment dose of 1-Mev electron/cm/sup 2/ needed to increase the excess current density by 1 amp/cm/sup 2/ at a bias of 0.3 v is 1.2 x 10/sup 16/ for P-doped diodes and 0.8 x 10/sup 16/ for Sb- or As-doped diodes. Upon annealing in an inert atmosphere, at temperature in the range 300 to 400 deg C, the bombarded diode is restored to its original characteristics. While the annealing studies reveal novel interactions, they show considerable similarity with other work where the radiation damage was monitored by carrier lifetime or conductivity measurements. Structures observed in the 1-V characteristics during the annealing indicate that the bombardment- induced levels at Ev + 0.27 and E/sub v/ + 0.06 are due to pairing of a primary defect (probably a vacancy) with an arsenic and a phosphorus impurity atom, respectively. (auth)
Research Organization:
Bell Telephone Labs., Inc., Murray Hill, N.J.
Sponsoring Organization:
USDOE
NSA Number:
NSA-15-025271
OSTI ID:
4018727
Journal Information:
Journal of Applied Physics (U.S.), Journal Name: Journal of Applied Physics (U.S.) Vol. Vol: 32; ISSN JAPIA
Country of Publication:
Country unknown/Code not available
Language:
English

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