Thermal management of a high power multichip module in a space environment
- Honeywell, Space Systems Group, 13350 U.S. Highway 19 North, Clearwater, Florida, 34642-7290 (United States)
- Rome Labs/ERDS, 525 Brooks Road, Griffiss AFB, New York 13441-4505 (United States)
As multichip module (MCM) power increases, thermal management becomes more challenging. A radiation hardened, 32 bit (RH-32) computer multichip module (MCM) is being developed under the MILSATCOM program using aluminum nitride (AlN) as the MCM package material. This state-of-the-art use of AlN provides excellent heat spreading and thermal management. The result is an MCM virtually without hot-spots. Unfortunately, use of AlN complicates a number of the standard MCM assembly and rework processes. This paper will discuss the use of AlN, present the results of a detailed thermal analysis and the work done to fine tune MCM assembly and rework processes. {copyright} {ital 1996 American Institute of Physics.}
- OSTI ID:
- 385445
- Report Number(s):
- CONF-960109--
- Journal Information:
- AIP Conference Proceedings, Journal Name: AIP Conference Proceedings Journal Issue: 1 Vol. 361; ISSN 0094-243X; ISSN APCPCS
- Country of Publication:
- United States
- Language:
- English
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