Mechanistic studies of SC-1 particle removal and post piranha rinsing

Conference · Tue Oct 01 00:00:00 EDT 1996

OSTI ID:378811

Resnick, P; Adkins, C; Clews, P; Matlock, C ^[1]; Kittelson, D; Kuehn, T; Gouk, R; Wu, Y ^[2]

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1. Sandia National Labs., Albuquerque, NM (United States)
2. Univ. of Minnesota, Minneapolis, MN (United States)

SC-1 (NH{sub 4}OH/H{sub 2}O{sub 2}/H{sub 2}O) and piranha (H{sub 2}SO{sub 4}/H{sub 2}O{sub 2}) cleans have been used for many years to remove particulate and organic contamination. Although the SC-1 clean, often used with applied megasonic power, is known to be highly effective for particle removal, the removal mechanism remains unclear. For the removal of heavy organic contamination, the piranha cleaning chemistry is an effective process; however, post-piranha residue adheres tenaciously to the wafer surface, causing a particle growth phenomenon. A series of experiments have been performed to help understand the interaction of these processes with silicon surfaces.

• Research Organization: Sandia National Labs., Albuquerque, NM (United States)
• Sponsoring Organization: Contamination Free Mfg. Research Center (United States)
• DOE Contract Number: AC04-94AL85000
• OSTI ID: 378811
• Report Number(s): SAND--96-2167C; CONF-9609107--3; ON: DE96014489
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
42 ENGINEERING
AMMONIUM HYDROXIDES
ETCHING
HYDROGEN PEROXIDE
KINETICS
ORGANIC COMPOUNDS
PARTICULATES
PASSIVATION
REMOVAL
SILICON
SILICON NITRIDES
SULFURIC ACID
SURFACE CLEANING
SURFACE PROPERTIES