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Spreading resistance profiling study of GeSi/Si structures by high dose Ge implantation into Si

Book ·
OSTI ID:375940
; ;  [1];  [2];  [3]
  1. Chinese Univ. of Hong Kong (Hong Kong)
  2. Beijing Normal Univ. (China)
  3. Charles Evans and Associates, Redwood City, CA (United States)
Hetero-structures of GeSi layers on Si have been produced by high dose Ge implantation into p-type (100) Si wafers at 150 or 300 keV at various doses. From spreading resistance profiling measurements, it is found that for samples implanted at 300 keV at a sufficiently high dose, there is an unexpected resistivity type conversion due to the Ge implantation. The depths of the n-p junction formed as-implanted can be larger than 1.5 {micro}m, far beyond the Ge projected range. Upon annealing, the junction position moves toward the surface and eventually stops at a depth corresponding to the thickness of the GeSi layer. However, no such n-p junction formation was observed in the spreading resistance profiles of the 150 keV implanted samples. These spreading resistance results are discussed in conjunction with results from RBS and SIMS experiments.
OSTI ID:
375940
Report Number(s):
CONF-941144--; ISBN 1-55899-255-3
Country of Publication:
United States
Language:
English