Structure-property relationships of nano-foam polyimide films with low dielectric constant and high thermal stability

Conference · Tue Oct 01 04:00:00 EDT 1996

OSTI ID:370887

Cha, H J; Hedrick, J; DiPietro, R A ^[1]

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1. IBM Almaden Research Center, San Jose, CA (United States)

Thin polyimide films with dispersed nano-foam morphology have been prepared successfully for the purpose of obtaining low dielectric polymer insulators for microelectronic applications. They were obtained by utilizing triblock copolymers where the thermally stable polyimide component was derived from pyromellitic dianhydride (PMDA) with 1,1-bis(4-aminophenyl)-1-phenyl-2,2,2-trifluroroethane (3F) and thermally labile (polypropylene oxide) (PO) component comprised the outside block of the ABA triblock architecture. The domain shapes in thin films before foaming were irregular due to the non-equilibrium nature of preparation conditions. Final nano-foam shapes and sizes seem very similar to the initial morphology of PO domains. The measured dielectric constant was found to decrease to {approximately}2.3 for the foamed polyimide film with 18% porosity, as compared with ca. 2.9 for the homopolymer, and to remain stable at high temperatures.

• OSTI ID: 370887
• Report Number(s): CONF-960376--
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
COPOLYMERS
DIELECTRIC PROPERTIES
FILMS
FOAMS
IMIDES
MORPHOLOGY
ORGANIC POLYMERS
POROSITY
THIN FILMS