Polyimide nanofoams for microelectronic applications: Nanofoams derived from 6FXDA/6FDAM-co-polypropylene oxide copolymers

Conference · Fri Dec 01 04:00:00 EST 1995

OSTI ID:126965

Carter, K R; Labadie, J W; DiPietro, R A ^[1]

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1. Almaden Research Center, San Jose, CA (United States); and others

As part of our research efforts to obtain thin film dielectric layers with very low dielectric constants for use in microelectronic devices, we have explored polyimide foams created using a block copolymer approach. In these systems the pore sizes are in the manometer range thus the term {open_quotes}nanofoam{close_quotes}. The polyimide foams are prepared from block copolymers consisting of thermally stabile and thermally labile blocks, the latter being the dispersed phase. Foam formation is effected by thermolysis of the thermally labile block leaving pores the size and shape corresponding to the initial copolymer morphology. Nanofoams of 6FXDA/6FDAm polyimide were investigated. These highly fluorinated polyimide foams showed a drop in refractive index, indicative of a significant lowering of the dielectric constant. The foams were characterized by a variety of techniques including, TEM, SAXS, WAXD, DMTA, density measurements mid refractive index measurement. Thin film, high modulus foams with good mechanical properties can be synthesized using the copolymer/nanofoam approach.

• OSTI ID: 126965
• Report Number(s): CONF-950402--
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
COPOLYMERS
FOAMS
IMIDES
LAYERS
MECHANICAL PROPERTIES
MORPHOLOGY
ORGANIC POLYMERS
PORE STRUCTURE
REFRACTIVE INDEX