A mathematical model for electroless copper deposition on planar substrates

Journal Article · Fri Jan 01 04:00:00 EST 1999 · Journal of the Electrochemical Society

DOI:https://doi.org/10.1149/1.1391572· OSTI ID:321135

Ramasubramanian, M; Popov, B N; White, R E ^[1]; Chen, K S ^[2]

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1. Univ. of South Carolina, Columbia, SC (United States)
2. Sandia National Labs., Albuquerque, NM (United States). Engineering Sciences Center

A mathematical model for the electroless deposition of copper on a planar electrode is presented and used to make time-dependent predictions on the various quantities in the system. The model takes into account mass transport by diffusion and migration, Butler-Volmer kinetics at the electrode surface, and mixed potential theory. A finite difference approach is used to solve the equations, and the resultant model is used to predict the concentration profiles, potential response, and plating rate as a function of time and concentration of various reactive components.

• Research Organization: Sandia National Laboratory
• Sponsoring Organization: USDOE, Washington, DC (United States)
• DOE Contract Number: AC04-94AL85000
• OSTI ID: 321135
• Journal Information: Journal of the Electrochemical Society, Journal Name: Journal of the Electrochemical Society Journal Issue: 1 Vol. 146; ISSN 0013-4651; ISSN JESOAN
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
CHEMICAL REACTION KINETICS
COPPER
ELECTRODEPOSITION
MATHEMATICAL MODELS