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Electroless copper plating

Patent ·
OSTI ID:872041
 [1]
  1. Lee's Summit, MO
+ Show Author Affiliations
An optimized electroless copper plating technique suitable for plating electroless copper upon ceramics.
Research Organization:
Kansas City Plant (KCP), Kansas City, MO (United States)
DOE Contract Number:
AC04-76DP00613
Assignee:
AlliedSignal Inc. (Morristown, NJ)
Patent Number(s):
US 5849355
Application Number:
08/717,195
OSTI ID:
872041
Country of Publication:
United States
Language:
English

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Related Subjects

/427/29/333/
ceramics
copper
copper plating
electroless
electroless copper
optimized
plating
suitable
technique