Electroless plating process

Patent · Tue Apr 15 04:00:00 EST 1969

OSTI ID:5323769

Baudrand, D W; Mallory, Jr, G O

A process is described for plating nonconductive materials, such as plastics, by means of an electroless transition metal plating bath at a temperature below the deformation temperature of the nonconductive material to be plated. The process provides for the sensitizing of the material to be plated and thereafter immersing the sensitized material in a plating bath. The bath is an aqueous solution of a transition metal salt, a transition metal reducing agent, a ligand complexing agent, and a carbonate buffering agent wherein the bath is maintained at a pH in the range of 7 to 11. The material to be plated is left in the bath until plating to the desired depth has been accomplished. (8 claims)

• Assignee: ARP Inc.
• Patent Number(s): US 3438798
• OSTI ID: 5323769
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
360100* -- Metals & Alloys
AQUEOUS SOLUTIONS
BUFFERS
DEPOSITION
DISPERSIONS
ELECTRICAL EQUIPMENT
ELECTRICAL INSULATORS
ELEMENTS
EQUIPMENT
MATERIALS
METALS
MIXTURES
PETROCHEMICALS
PETROLEUM PRODUCTS
PLASTICS
PLATING
REDUCING AGENTS
SOLUTIONS
SURFACE COATING
SYNTHETIC MATERIALS
TRANSITION ELEMENT COMPOUNDS
TRANSITION ELEMENTS