Kinetics and mechanism of electroless deposition of copper

Journal Article · Thu Feb 01 04:00:00 EST 1996 · Journal of the Electrochemical Society

DOI:https://doi.org/10.1149/1.1836473· OSTI ID:212157

Mishra, K G; Paramguru, R K ^[1]

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1. Council of Scientific and Industrial Research, Orissa (India). Regional Research Lab.

This paper describes investigations on the role of electrolyte composition on the mechanism of the electroless copper deposition process. Both potentiostatic and galvanostatic polarization curves as well as steady-state plots are used in these investigations. Actual deposition rates are also measured through gravimetrically determined weight gain for comparison. The observation indicates that the two-compartment cell gives the mixed potential, E{sub m}, values closer to that of the actual plating, whereas the deposition rate determined from the mixed current, i{sub m}, value is lower than that of the actual one. The mechanism of electroless copper deposition changes from anodic to cathodic control as well as from diffusion to activation control depending on the concentration of Cu{sup ++} and HCHO. The mechanism in each case could be determined through the application of the Butler-Volmer equation to the half-cell reactions depending on the position of E{sub m} in the polarization plots of the individual half-cell reactions.

• Sponsoring Organization: USDOE
• OSTI ID: 212157
• Journal Information: Journal of the Electrochemical Society, Journal Name: Journal of the Electrochemical Society Journal Issue: 2 Vol. 143; ISSN 0013-4651; ISSN JESOAN
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
CHEMICAL COMPOSITION
CHEMICAL REACTION KINETICS
COPPER
ELECTROCHEMICAL CELLS
ELECTROLYTES
ELECTROPLATING
FORMALDEHYDE