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Title: Deposition of device quality low H content, amorphous silicon films

Patent ·
OSTI ID:27691

A high quality, low hydrogen content, hydrogenated amorphous silicon (a-Si:H) film is deposited by passing a stream of silane gas (SiH{sub 4}) over a high temperature, 2,000 C, tungsten (W) filament in the proximity of a high temperature, 400 C, substrate within a low pressure, 8 mTorr, deposition chamber. The silane gas is decomposed into atomic hydrogen and silicon, which in turn collides preferably not more than 20--30 times before being deposited on the hot substrate. The hydrogenated amorphous silicon films thus produced have only about one atomic percent hydrogen, yet have device quality electrical, chemical, and structural properties, despite this lowered hydrogen content. 7 figs.

Research Organization:
National Renewable Energy Laboratory (NREL), Golden, CO (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
AC02-83CH10093
Assignee:
Dept. of Energy, Washington, DC (United States)
Patent Number(s):
US 5,397,737/A/
Application Number:
PAN: 8-253,840
OSTI ID:
27691
Resource Relation:
Other Information: PBD: 14 Mar 1995
Country of Publication:
United States
Language:
English