Quality concerns caused by quality control — deformation of silicon strip detector modules in thermal cycling tests

Journal Article · Tue Mar 04 00:00:00 EST 2025 · Journal of Instrumentation

DOI:https://doi.org/10.1088/1748-0221/20/03/p03004· OSTI ID:2557484

Salami, Richard ^[1]; Poley, Luise ^[1]; Affolder, Kirsten ^[2]; Affolder, Tony ^[2]; Bayer, Lukas ^[3]; Crick, Ben ^[4]; Duden, Emily ^[5]; Dyckes, Ian George ^[6]; Fadeyev, Vitaliy ^[2]; Fortman, Anne ^[6]; Federič, Pavol ^[7]; Franconi, Laura ^[3]; Gignac, Matthew ^[2]; Gupta, Shubham ^[5]; Hallford, John ^[3]; Helling, Cole ^[8]; Hill, Ewan ^[4]; Hu, Miao ^[6]; Kroll, Jiří ^[7]; Kumari, Priyanka ^[9] ; Lacasta, Carlos ^[10]; Levagood, Madison ^[8]; Lopez, Hanlez ^[10]; Morelos-Zaragoza, Len ^[2]; Moshe, Meny Raviv ^[11]; Petersen, Aaron ^[5]; Platero, Vicente ^[10]; Rajagopalan, Archa Devi ^[1]; Sitnikova, Lisa ^[3]; Solaz, Carles ^[10]; Soldevila, Urmila ^[10]; Speers, Peter ^[1]; Nieuwenhuizen, Gerrit Van ^[11]; Wang, Alex Zeng ^[2]

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1. Simon Fraser Univ., Burnaby, BC (Canada); TRIUMF, Vancouver, BC (Canada)
2. Univ. of California, Santa Cruz, CA (United States)
3. Deutsches Elektronen-Synchrotron (DESY), Hamburg (Germany)
4. Univ. of Toronto, ON (Canada)
5. Brandeis Univ., Waltham, MA (United States)
6. Lawrence Berkeley National Laboratory (LBNL), Berkeley, CA (United States)
7. Charles Univ., Prague (Czech Republic)
8. Univ. of British Columbia, Vancouver, BC (Canada)
9. York Univ., Toronto, ON (Canada)
10. Consejo Superior de Investigaciones Cientificas (CSIC) (Spain); Univ. of Valencia (Spain)
11. Brookhaven National Laboratory (BNL), Upton, NY (United States)

The ATLAS experiment at the Large Hadron Collider (LHC) is currently preparing to replace its present Inner Detector (ID) with the upgraded, all-silicon Inner Tracker (ITk) for its High-Luminosity upgrade (HL-LHC). The ITk will consist of a central pixel tracker and the outer strip tracker, consisting of about 19,000 strip detector modules. Each strip module is assembled from up to two sensors, and up to five flexes (depending on its geometry) in a series of gluing, wirebonding and quality control steps. During detector operation, modules will be cooled down to temperatures of about -35 °C (corresponding to the temperature of the support structures on which they will be mounted) after being initially assembled and stored at room temperature. In order to ensure compatibility with the detector's operating temperature range, modules are subjected to thermal cycling as part of their quality control process. Ten cycles between -35 °C and +40 °C are performed for each module, with full electrical characterisation tests at each high and low temperature point. As part of an investigation into the stress experienced by modules during cooling, it was observed that modules generally showed a change in module shape before and after thermal cycling. This paper presents a summary of the discovery and understanding of the observed changes, connecting them with excess module stress, as well as the resulting modifications to the module thermal cycling procedure.

• Research Organization: Lawrence Berkeley National Laboratory (LBNL), Berkeley, CA (United States)
• Sponsoring Organization: USDOE Office of Science (SC)
• Grant/Contract Number: AC02-05CH11231; SC0010107
• OSTI ID: 2557484
• Journal Information: Journal of Instrumentation, Journal Name: Journal of Instrumentation Journal Issue: 03 Vol. 20; ISSN 1748-0221
• Publisher: Institute of Physics (IOP)
• Country of Publication: United States
• Language: English

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