Electrical two and three dimensional modelling of high-speed board to board interconnections
Conference
·
OSTI ID:249922
- Teradyne, Inc., Nashua, NH (United States)
In today`s high speed electronic systems, board-to-board connectors can contribute to signal degradation, reflections, and crosstalk. Methods exist for using computer modeling to predict the electrical behavior of interconnections from a knowledge of their materials and construction. A typical modeling process utilizes a combination of 2 or 3 dimensional electromagnetic field solvers to derive an approximate circuit model of the connector. Predictions of connector electrical performance are then obtained by plugging this connector model into a model test circuit and simulating the combination with circuit simulation software such as SPICE.
- OSTI ID:
- 249922
- Report Number(s):
- CONF-9511143--
- Country of Publication:
- United States
- Language:
- English
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