Transmission of high speed electrical signals in a Josephson package

Journal Article · Sun May 01 04:00:00 EDT 1983 · IEEE Trans. Magn.; (United States)

DOI:https://doi.org/10.1109/TMAG.1983.1062325· OSTI ID:5747223

Anderson, C; Ketchen, M; Klein, M

It is proposed that Josephson circuit chips are housed in a threedimensional, card-on-board package operated near 4.2K. In this technology logic signals travel on matched, low-loss, superconducting transmission lines and through low resistance but inductive package connectors. In an experiment designed to model closely the electrical environment of this package, the waveform of a Josephson driver signal was measured before and after propagation through a card-tocard path in the package. The measurements were made on-chip using Josephson sampling techniques. The degradation in risetime of a 125ps driver signal was less than 20ps; crosstalk to a parallel path through the package was less than 2%. The inductances of right angle and pluggable micropin connectors were determined using an impedance current split experiment. Measured values of about 100pH and 250pH respectively are in good agreement with numerical calculations.

• Research Organization: IBM Thomas J. Watson Research Center, Yorktown Heights, NY 10598
• OSTI ID: 5747223
• Journal Information: IEEE Trans. Magn.; (United States), Journal Name: IEEE Trans. Magn.; (United States) Vol. 19:3; ISSN IEMGA
• Country of Publication: United States
• Language: English

Related Subjects

420201* -- Engineering-- Cryogenic Equipment & Devices
71 CLASSICAL AND QUANTUM MECHANICS
GENERAL PHYSICS
DESIGN
ELECTRIC IMPEDANCE
ELECTRONIC CIRCUITS
IMPEDANCE
JOSEPHSON JUNCTIONS
JUNCTIONS
LOGIC CIRCUITS
POWER TRANSMISSION LINES
PULSE RISE TIME
SIGNALS
SUPERCONDUCTING JUNCTIONS
TIMING PROPERTIES
WAVE FORMS