Josephson cross-sectional model experiment

Journal Article · Mon Apr 01 04:00:00 EST 1985 · J. Appl. Phys.; (United States)

DOI:https://doi.org/10.1063/1.335444· OSTI ID:6105129

Ketchen, M B; Herrell, D J; Anderson, C J

This paper describes the electrical design and evaluation of the Josephson cross-sectional model (CSM) experiment. The experiment served as a test vehicle to verify the operation at liquid-helium temperatures of Josephson circuits integrated in a package environment suitable for high-performance digital applications. The CSM consisted of four circuit chips assembled on two cards in a three-dimensional card-on-board package. The chips (package) were fabricated in a 2.5-..mu..m (5-..mu..m) minimum linewidth Pb-alloy technology. A hierarchy of solder and pluggable connectors was used to attach the parts together and to provide electrical interconnections between parts. A data path which simulated a jump control sequence and a cache access in each machine cycle was successfully operated with cycle times down to 3.7 ns. The CSM incorporated the key components of the logic, power, and package of a prototype Josephson signal processor and demonstrated the feasibility of making such a processor with a sub-4-ns cycle time.

• Research Organization: IBM T. J. Watson Research Center, Yorktown Heights, New York 10598
• OSTI ID: 6105129
• Journal Information: J. Appl. Phys.; (United States), Journal Name: J. Appl. Phys.; (United States) Vol. 57:7; ISSN JAPIA
• Country of Publication: United States
• Language: English

Related Subjects

420201* -- Engineering-- Cryogenic Equipment & Devices
71 CLASSICAL AND QUANTUM MECHANICS
GENERAL PHYSICS
ALLOYS
ELECTRONIC CIRCUITS
INTEGRATED CIRCUITS
JOSEPHSON JUNCTIONS
JUNCTIONS
LEAD ALLOYS
MICROELECTRONIC CIRCUITS
OPERATION
SUPERCONDUCTING JUNCTIONS