Modular cryogenic interconnects for multi-qubit devices

Journal Article · Sat Nov 15 04:00:00 EST 2014 · Review of Scientific Instruments

DOI:https://doi.org/10.1063/1.4900948· OSTI ID:22392243

Colless, J. I.

We have developed a modular interconnect platform for the control and readout of multiple solid-state qubits at cryogenic temperatures. The setup provides 74 filtered dc-bias connections, 32 control and readout connections with −3 dB frequency above 5 GHz, and 4 microwave feed lines that allow low loss (less than 3 dB) transmission 10 GHz. The incorporation of a radio-frequency interposer enables the platform to be separated into two printed circuit boards, decoupling the simple board that is bonded to the qubit chip from the multilayer board that incorporates expensive connectors and components. This modular approach lifts the burden of duplicating complex interconnect circuits for every prototype device. We report the performance of this platform at milli-Kelvin temperatures, including signal transmission and crosstalk measurements.

• OSTI ID: 22392243
• Journal Information: Review of Scientific Instruments, Journal Name: Review of Scientific Instruments Journal Issue: 11 Vol. 85; ISSN 0034-6748; ISSN RSINAK
• Country of Publication: United States
• Language: English

Related Subjects

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND TECHNOLOGY
CONNECTORS
CONTROL
DECOUPLING
GHZ RANGE 01-100
MICROWAVE RADIATION
PRINTED CIRCUITS
QUBITS
RADIOWAVE RADIATION
READOUT SYSTEMS