Apparatus and method for facilitating planar delayering of integrated circuit die
An apparatus and method for facilitating the removal of layers from a die for an integrated circuit while maintaining the planarity of the surface of the die by avoiding rounding the corners and other edges of the die. A pocket is created in a sacrificial material, such that when the die is inserted into the pocket the edges of the die are contiguous with the walls of the pocket and a top surface of the die is coplanar with a top surface of the pocket. The sacrificial material may be the same material as the die. An adhesive substance is placed in the pocket, and the die is inserted into the pocket and against the adhesive substance which aids in retaining the die in the pocket. The layers may then be removed from the die and the sacrificial material around the die without rounding the edges of the die.
- Research Organization:
- Kansas City Plant (KCP), Kansas City, MO (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- NA0000622
- Assignee:
- Honeywell Federal Manufacturing & Technologies, LLC (Kansas City, MO)
- Patent Number(s):
- 11,810,808
- Application Number:
- 16/669,851
- OSTI ID:
- 2293838
- Country of Publication:
- United States
- Language:
- English
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