Controlled High Filler Loading of Functionalized Al{sub 2}O{sub 3}-Filled Epoxy Composites for LED Thermal Management
- Universiti Sains Malaysia, Nano Optoelectronics Research Laboratory, School of Physics (Malaysia)
- OSRAM Opto Semiconductors (Malaysia)
- OSRAM Opto Semiconductors GmbH (Germany)
Thermal management in light-emitting diode (LED) has been extensively researched recently. This study is intended to develop an effective thermally conductive epoxy composite as thermal interface material (TIM) for headlamp LEDs. Silane-functionalized aluminum oxide (Al{sub 2}O{sub 3}) powder of different average particle sizes (44 and 10 µm) was studied for its feasibility as filler at its maximum loading. A detailed comparison of three different methods of particle dispersions, hand-mix, speed-mix and calendaring process (3-roll mill), has been reported. The dispersion of Al{sub 2}O{sub 3} particles, the thermal conductivity and thermal degradation characteristics of the composites were investigated and explained in detail. At 75 wt.% filler loading, 10 and 44 µm Al{sub 2}O{sub 3} achieved composite thermal conductivities of 1.13 and 2.08 W/mK, respectively, which is approximately 528 and 1055% of enhancement with respect to neat epoxy. The package-level thermal performance of the LED employing the Al{sub 2}O{sub 3}-filled TIMs was carried out using thermal transient analysis. The experimental junction-to-ambient thermal resistances (R{sub thJ-A}) achieved were 6.65, 7.24, and 8.63 K/W for Al{sub 2}O{sub 3-44µm}, Al{sub 2}O{sub 3-10µm} and neat epoxy, respectively. The results revealed that the Al{sub 2}O{sub 3-44µm} fillers-filled composite performed better in both material-level and package-level thermal characteristics.
- OSTI ID:
- 22858058
- Journal Information:
- Journal of Materials Engineering and Performance, Journal Name: Journal of Materials Engineering and Performance Journal Issue: 3 Vol. 27; ISSN 1059-9495; ISSN JMEPEG
- Country of Publication:
- United States
- Language:
- English
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