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Properties of AlN films deposited by reactive ion-plasma sputtering

Journal Article · · Semiconductors
The properties of SiO{sub 2}, Al{sub 2}O{sub 3}, and AlN dielectric coatings deposited by reactive ion-plasma sputtering are studied. The refractive indices of the dielectric coatings are determined by optical ellipsometry. It is shown that aluminum nitride is the optimal material for achieving maximum illumination of the output mirror of a semiconductor laser. A crystalline phase with a hexagonal atomic lattice and oxygen content of up to 10 at % is found by transmission electron microscopy in the aluminum-nitride films. It is found that a decrease in the concentration of residual oxygen in the chamber of the reactive ion-plasma sputtering installation makes it possible to eliminate the appearance of vertical pores in the bulk of the aluminum-nitride film.
OSTI ID:
22469713
Journal Information:
Semiconductors, Journal Name: Semiconductors Journal Issue: 10 Vol. 49; ISSN SMICES; ISSN 1063-7826
Country of Publication:
United States
Language:
English

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