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Interface defects in SiC power MOSFETs - An electrically detected magnetic resonance study based on spin dependent recombination

Journal Article · · AIP Conference Proceedings
DOI:https://doi.org/10.1063/1.4865627· OSTI ID:22263682
 [1];  [2];  [3];  [4];  [5]
  1. KAI GmbH, Europastrasse 8, 9500 Villach, Austria and Graz University of Technology - Institute of Solid State Physics, Petersgasse 16, 8020 Graz (Austria)
  2. Graz University of Technology - Institute of Solid State Physics, Petersgasse 16, 8020 Graz (Austria)
  3. Graz University of Technology - Institute of Experimental Physics, Petersgasse 16, 8020 Graz (Austria)
  4. Infineon Technologies, Schottkystrasse 10, 91058 Erlangen (Germany)
  5. Infineon Technologies, Siemensstrasse 2, 9500 Villach (Australia)
This study presents electrically detected magnetic resonance (EDMR) measurements on a silicon carbide (SiC) MOSFET having the structure of a double-diffused silicon MOSFET (DMOS). The resonance pattern of a SiC DMOS was measured by monitoring the change of the recombination current between the source/body and the drain. The amplitude of the response has a maximum when the device is biased in depletion due to the equal concentrations of electrons and holes at the interface resulting in the most efficient recombination. The measured anisotropic g-tensor has axial symmetry with g{sub ∥} = 2.0051(4) (B ‖ c-axis), and g{sub ⊥} = 2.0029(4) (B⊥ c-axis) and the pattern shows several hyperfine (HF) peaks. We tentatively identify the observed defect as a silicon vacancy located directly at the interface.
OSTI ID:
22263682
Journal Information:
AIP Conference Proceedings, Journal Name: AIP Conference Proceedings Journal Issue: 1 Vol. 1583; ISSN APCPCS; ISSN 0094-243X
Country of Publication:
United States
Language:
English

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