Micro-Scale Evaluation Of Interface Strength On The Patterned Structures In LSI Interconnects

Journal Article · Wed Nov 24 00:00:00 EST 2010 · AIP Conference Proceedings

DOI:https://doi.org/10.1063/1.3527134· OSTI ID:21506809

Kamiya, Shoji; Sato, Hisashi; Nishida, Masahiro; Chen, Chuantong; Shishido, Nobuyuki ^[1]; Omiya, Masaki ^[2]; Suzuki, Takashi; Nakamura, Tomoji ^[3]; Nokuo, Takeshi; Nagasawa, Tadahiro ^[4]

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1. Nagoya Institute of Technology, Gokiso-cho, Showa-ku, Nagoya-city (Japan)
2. Keio University, Hiyoshi, Kohoku-ku, Yokohama-city (Japan)
3. Fujitsu Laboratories Ltd., Morinosato Wakamiya, Atsugi-city (Japan)
4. JEOL Ltd., Musashino, Akishima-city (Japan)

Reliability of electronic devices has been an issue of serious importance. One of the potential factors to spoil the reliability is possible local drops of strength on the interface of multilayered structure. A new technique for the evaluation of local interface adhesion energy was applied to the interface between Cu and cap layer in a Cu damascene interconnect structure, in order to elucidate variation in adhesion strength as a function of measurement location.

• OSTI ID: 21506809
• Journal Information: AIP Conference Proceedings, Vol. 1300, Issue 1; Conference: 11. international workshop on stress-induced phenomena in metallization, Bad Schandau (Germany), 12-14 Apr 2010; Other Information: DOI: 10.1063/1.3527134; (c) 2010 American Institute of Physics; ISSN 0094-243X
• Country of Publication: United States
• Language: English

Related Subjects

75 CONDENSED MATTER PHYSICS
SUPERCONDUCTIVITY AND SUPERFLUIDITY
ADHESION
COPPER
ELECTRONIC EQUIPMENT
EVALUATION
FOCUSING
FRACTURES
INTERFACES
LAYERS
RELIABILITY
ELEMENTS
EQUIPMENT
FAILURES
METALS
TRANSITION ELEMENTS