Determination of Interfacial Adhesion Strength between Oxide Scale and Substrate for Metallic SOFC Interconnects

Journal Article · Mon Jan 21 04:00:00 EST 2008 · Journal of Power Sources, 176(1):167-174

DOI:https://doi.org/10.1016/j.jpowsour.2007.10.027· OSTI ID:924671

Sun, Xin; Liu, Wenning N; Stephens, Elizabeth V; Khaleel, Mohammad A

The interfacial adhesion strength between the oxide scale and the substrate is crucial to the reliability and durability of metallic interconnects in SOFC operating environments. It is necessary, therefore, to establish a methodology to quantify the interfacial adhesion strength between the oxide scale and the metallic interconnect substrate, and furthermore to design and optimize the interconnect material as well as the coating materials to meet the design life of an SOFC system. In this paper, we present an integrated experimental/analytical methodology for quantifying the interfacial adhesion strength between oxide scale and a ferritic stainless steel interconnect. Stair-stepping indentation tests are used in conjunction with subsequent finite element analyses to predict the interfacial strength between the oxide scale and Crofer 22 APU substrate.

• Research Organization: Pacific Northwest National Laboratory (PNNL), Richland, WA (US)
• Sponsoring Organization: USDOE
• DOE Contract Number: AC05-76RL01830
• OSTI ID: 924671
• Report Number(s): PNNL-SA-56937; AA2530000
• Journal Information: Journal of Power Sources, 176(1):167-174, Journal Name: Journal of Power Sources, 176(1):167-174
• Country of Publication: United States
• Language: English