Time-resolved investigation of dual high power impulse magnetron sputtering with closed magnetic field during deposition of Ti-Cu thin films

Journal Article · Sun Aug 15 04:00:00 EDT 2010 · Journal of Applied Physics

DOI:https://doi.org/10.1063/1.3467001· OSTI ID:21476418

Stranak, Vitezslav; Hippler, Rainer ^[1]; Cada, Martin; Hubicka, Zdenek ^[2]; Tichy, Milan ^[3]

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1. Institut fuer Physik, Ernst-Moritz-Arndt-Universitaet Greifswald, Felix-Hausdorff-Str. 6, 17489 Greifswald (Germany)
2. Institute of Physics v.v.i., Academy of Science of the Czech Republic, Na Slovance 2, 182 21 Praha 8 (Czech Republic)
3. Faculty of Mathematics and Physics, Charles University in Prague, V Holesovickach 2, 180 00 Prague 8 (Czech Republic)

Time-resolved comparative study of dual magnetron sputtering (dual-MS) and dual high power impulse magnetron sputtering (dual-HiPIMS) systems arranged with closed magnetic field is presented. The dual-MS system was operated with a repetition frequency 4.65 kHz (duty cycle {approx_equal}50%). The frequency during dual-HiPIMS is lower as well as its duty cycle (f=100 Hz, duty 1%). Different metallic targets (Ti, Cu) and different cathode voltages were applied to get required stoichiometry of Ti-Cu thin films. The plasma parameters of the interspace between magnetrons in the substrate position were investigated by time-resolved optical emission spectroscopy, Langmuir probe technique, and measurement of ion fluxes to the substrate. It is shown that plasma density as well as ion flux is higher about two orders of magnitude in dual-HiPIMS system. This fact is partially caused by low diffusion of ionized sputtered particles (Ti{sup +},Cu{sup +}) which creates a preionized medium.

• OSTI ID: 21476418
• Journal Information: Journal of Applied Physics, Journal Name: Journal of Applied Physics Journal Issue: 4 Vol. 108; ISSN JAPIAU; ISSN 0021-8979
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
70 PLASMA PHYSICS AND FUSION TECHNOLOGY
ALLOYS
CHARGED PARTICLES
COPPER ALLOYS
COPPER IONS
DEPOSITION
DIFFUSION
ELECTRIC POTENTIAL
ELECTRIC PROBES
EMISSION SPECTROSCOPY
FILMS
FREQUENCY RANGE
IONIZATION
IONS
KHZ RANGE
LANGMUIR PROBE
MAGNETIC FIELDS
PLASMA
PLASMA DENSITY
PROBES
PULSES
RESOLUTION
SPECTROSCOPY
SPUTTERING
STOICHIOMETRY
SUBSTRATES
THIN FILMS
TIME RESOLUTION
TIMING PROPERTIES
TITANIUM ALLOYS
TITANIUM IONS
TRANSITION ELEMENT ALLOYS