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Title: Electrical Characteristics and Interface Properties of III Nitride-Based Metal-Insulator-Semiconductor Structure

Journal Article · · AIP Conference Proceedings
DOI:https://doi.org/10.1063/1.3469610· OSTI ID:21431089
; ;  [1];  [2]
  1. Nano-Opoelectronics Research Laboratory, School of Physics, Universiti Sains Malaysia, 11800 Penang (Malaysia)
  2. School of Materials and Mineral Resources Engineering, USM Engineering Campus, Seri Ampangan, 14300 Seberang Prai Selatan, Penang (Malaysia)

In this work, III-Nitride based metal-insulator-semiconductor (MIS) structure has been studied using AlN/GaN heterostructures on Si (111) with AlN buffer layer grown by plasma-assisted molecular beam epitaxy (MBE). The structural and electrical characteristics of the films were studied through high resolution x-ray diffraction (HRXRD), capacitance-voltage (C-V) and current-voltage (I-V) measurements. The value of flat-band voltage was -0.7 V. A total fixed oxide charge density of 2.73x10{sup 11} cm{sup -2} was estimated. Terman's method was used to obtain the density of interface state in the MIS structure. The analysis showed low interface state density values of 3.66x10{sup 11} cm{sup -2} eV{sup -1}.

OSTI ID:
21431089
Journal Information:
AIP Conference Proceedings, Vol. 1250, Issue 1; Conference: PERFIK2009: National physics conference 2009, Malacca (Malaysia), 7-9 Dec 2009; Other Information: DOI: 10.1063/1.3469610; (c) 2010 American Institute of Physics; ISSN 0094-243X
Country of Publication:
United States
Language:
English