A hybrid encapsulation method for organic electronics

Journal Article · Mon Apr 20 04:00:00 EDT 2009 · Applied Physics Letters

DOI:https://doi.org/10.1063/1.3115144· OSTI ID:21294052

Kim, N; Graham, S ^[1]; Potscavage, Jr, W J; Domercq, B; Kippelen, B ^[2]

---

1. Center for Organic Photonics and Electronics and Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332 (United States)
2. Center for Organic Photonics and Electronics and School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332 (United States)

We report a thin-film encapsulation method for organic electronics that combines the deposition of a layer of SiO{sub x} or SiN{sub x} (100 nm) by plasma enhanced chemical vapor deposition followed by a layer of Al{sub 2}O{sub 3} (10-50 nm) by atomic layer deposition and a 1-{mu}m-thick layer of parylene by chemical vapor deposition. The effective water vapor transmission rates of the encapsulation was (2{+-}1)x10{sup -5} g/m{sup 2} day at 20 deg. C and 50% relative humidity (RH). The encapsulation was integrated with pentacene/C{sub 60} solar cells, which showed no decrease in conversion efficiency after 5800 h of exposure to air demonstrating the effectiveness of the encapsulation methodology.

• OSTI ID: 21294052
• Journal Information: Applied Physics Letters, Journal Name: Applied Physics Letters Journal Issue: 16 Vol. 94; ISSN APPLAB; ISSN 0003-6951
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
AIR
ALUMINIUM OXIDES
CHEMICAL VAPOR DEPOSITION
ENCAPSULATION
FULLERENES
HUMIDITY
LAYERS
ORGANIC SEMICONDUCTORS
PENTACENE
SILICON NITRIDES
SILICON OXIDES
SOLAR CELLS
THIN FILMS
WATER VAPOR