Gas diffusion ultrabarriers on polymer substrates using Al{sub 2}O{sub 3} atomic layer deposition and SiN plasma-enhanced chemical vapor deposition

Journal Article · Wed Jul 15 04:00:00 EDT 2009 · Journal of Applied Physics

DOI:https://doi.org/10.1063/1.3159639· OSTI ID:21359324

Carcia, P F; McLean, R S ^[1]; Groner, M D; Dameron, A A ^[2]; George, S M ^[2]

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1. DuPont Central Research and Development, Wilmington, Delaware 19880 (United States)
2. Deparment of Chemistry and Biochemistry, University of Colorado, Boulder, Colorado 80309 (United States)

Thin films grown by Al{sub 2}O{sub 3} atomic layer deposition (ALD) and SiN plasma-enhanced chemical vapor deposition (PECVD) have been tested as gas diffusion barriers either individually or as bilayers on polymer substrates. Single films of Al{sub 2}O{sub 3} ALD with thicknesses of >=10 nm had a water vapor transmission rate (WVTR) of <=5x10{sup -5} g/m{sup 2} day at 38 deg. C/85% relative humidity (RH), as measured by the Ca test. This WVTR value was limited by H{sub 2}O permeability through the epoxy seal, as determined by the Ca test for the glass lid control. In comparison, SiN PECVD films with a thickness of 100 nm had a WVTR of approx7x10{sup -3} g/m{sup 2} day at 38 deg. C/85% RH. Significant improvements resulted when the SiN PECVD film was coated with an Al{sub 2}O{sub 3} ALD film. An Al{sub 2}O{sub 3} ALD film with a thickness of only 5 nm on a SiN PECVD film with a thickness of 100 nm reduced the WVTR from approx7x10{sup -3} to <=5x10{sup -5} g/m{sup 2} day at 38 deg. C/85% RH. The reduction in the permeability for Al{sub 2}O{sub 3} ALD on the SiN PECVD films was attributed to either Al{sub 2}O{sub 3} ALD sealing defects in the SiN PECVD film or improved nucleation of Al{sub 2}O{sub 3} ALD on SiN.

• OSTI ID: 21359324
• Journal Information: Journal of Applied Physics, Journal Name: Journal of Applied Physics Journal Issue: 2 Vol. 106; ISSN JAPIAU; ISSN 0021-8979
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
ALUMINIUM COMPOUNDS
ALUMINIUM OXIDES
CHALCOGENIDES
CHEMICAL COATING
CHEMICAL VAPOR DEPOSITION
DEPOSITION
DIFFUSION BARRIERS
DIMENSIONS
EPOXIDES
FILMS
FLUIDS
GASES
HUMIDITY
LAYERS
MOISTURE
NITRIDES
NITROGEN COMPOUNDS
NUCLEATION
ORGANIC COMPOUNDS
ORGANIC OXYGEN COMPOUNDS
OXIDES
OXYGEN COMPOUNDS
PERMEABILITY
PHYSICAL PROPERTIES
PLASMA
PNICTIDES
POLYMERS
SILICON COMPOUNDS
SILICON NITRIDES
SUBSTRATES
SURFACE COATING
THICKNESS
THIN FILMS
VAPORS
WATER VAPOR