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Correlation between sputtering parameters and composition of SmCo-based films for microelectromechanical system applications

Journal Article · · Journal of Applied Physics
DOI:https://doi.org/10.1063/1.3098230· OSTI ID:21190095
; ; ; ;  [1];  [2]
  1. State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054 (China)
  2. Department of Physics and Astronomy, University of Delaware, Newark, Delaware 19716 (United States)
About 3.0 {mu}m thick SmCo-based films with additives of Fe, Cu, and Zr were deposited on Si substrates. Based on a developed semiempirical theoretical model, the dependence of the film composition on the sputtering parameters was discussed. The experimental results show that the Sm concentration increases with decreasing sputtering power or increasing Ar gas pressure, which are in good agreement with the calculated results when the preferential sputtering effect is disregarded. The effect of the sputtering parameters on the film composition provides an opportunity for the same composite target to fabricate films with Sm concentration varying from 13.8 to 17.3 at. %, which is reasonable for the permanent magnetic phase transformation (Sm{sub 2}Co{sub 17}{yields}SmCo{sub 7}{yields}SmCo{sub 5}). Furthermore, the observed TbCu{sub 7}-type film shows a better crystal texture with a low remanence ratio for the hysteresis loops measured out plane to in plane of 0.08.
OSTI ID:
21190095
Journal Information:
Journal of Applied Physics, Journal Name: Journal of Applied Physics Journal Issue: 6 Vol. 105; ISSN JAPIAU; ISSN 0021-8979
Country of Publication:
United States
Language:
English

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