Skip to main content
U.S. Department of Energy
Office of Scientific and Technical Information

Deposition of carbon-free silicon dioxide from pure hexamethyldisiloxane using an atmospheric microplasma jet

Journal Article · · Applied Physics Letters
DOI:https://doi.org/10.1063/1.2844880· OSTI ID:21120591
; ;  [1]
  1. Arbeitsgruppe Reaktive Plasmen, Fakultaet fuer Physik und Astronomie, Ruhr-Universitaet Bochum, 44780 Bochum (Germany)
Carbon-free silicon dioxide has been deposited at room temperature by injection of pure hexamethyldisiloxane (HMDSO) into an atmospheric pressure microplasma jet from argon. At low HMDSO flow rates [<0.1 SCCM (SCCM denotes cubic centimeter per minute at STP)], the SiO{sub x}H{sub z} films contain no carbon and exhibit an oxygen to silicon ratio close to 2 according to x-ray photoelectron spectroscopy. At high HMDSO flow rates (>0.1 SCCM), SiO{sub x}C{sub y}H{sub z} films with a carbon content of up to 21% are obtained. The transition between organic to inorganic film is confirmed by Fourier transformed infrared spectroscopy. The deposition of inorganic films without oxygen admixture is explained by an ion-induced polymerization scheme of HMDSO.
OSTI ID:
21120591
Journal Information:
Applied Physics Letters, Journal Name: Applied Physics Letters Journal Issue: 9 Vol. 92; ISSN APPLAB; ISSN 0003-6951
Country of Publication:
United States
Language:
English

Similar Records

Deposition of silicon dioxide films using an atmospheric pressure microplasma jet
Journal Article · Wed Apr 15 00:00:00 EDT 2009 · Journal of Applied Physics · OSTI ID:21356099

Surface reactions as carbon removal mechanism in deposition of silicon dioxide films at atmospheric pressure
Journal Article · Mon Mar 14 00:00:00 EDT 2011 · Applied Physics Letters · OSTI ID:21518322

Type of precursor and synthesis of silicon oxycarbide (SiO{sub x}C{sub y}H) thin films with a surfatron microwave oxygen/argon plasma
Journal Article · Sat Jul 15 00:00:00 EDT 2006 · Journal of Vacuum Science and Technology. A, International Journal Devoted to Vacuum, Surfaces, and Films · OSTI ID:20777356