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High microwave power ECR etching of III-V semiconductors in CH{sub 4}/H{sub 2}/Ar

Conference ·
OSTI ID:208359
; ; ; ;  [1]; ;  [2];  [3]
  1. Florida Univ., Gainesville, FL (United States)
  2. AT and T Bell Labs., Murray Hill, NJ (United States)
  3. Sandia National Labs., Albuquerque, NM (United States)

Etch rates up to 7000{angstrom}/min for InP and 3500{angstrom}/min for GaAs are obtained for high microwave power (1000W) CH{sub 4}/H{sub 2}/Ar Electron Cyclotron Resonance plasma etching. Preferential loss of the group V element leads to nonstoichiometric, unacceptably rough surfaces on In-based binary semiconductors at microwave powers {ge}400W, regardless of plasma composition. Both Ga- and Al-based materials retain smooth, stoichiometric surfaces even at I000W, but the rates are still much slower than for C1{sub 2} plasma chemistries. The results suggest that CH{sub 4}/H{sub 2} plasmas are not well suited to ECR systems operating at high powers.

Research Organization:
Sandia National Labs., Albuquerque, NM (United States)
Sponsoring Organization:
Department of Defense, Washington, DC (United States)
DOE Contract Number:
AC04-94AL85000
OSTI ID:
208359
Report Number(s):
SAND--96-0693C; CONF-960502--4; ON: DE96007053
Country of Publication:
United States
Language:
English

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