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Dependence of plasma characteristics on dc magnetron sputter parameters

Journal Article · · Journal of Applied Physics
DOI:https://doi.org/10.1063/1.2112177· OSTI ID:20719566
 [1]
  1. Recording Media Operation, Seagate Technology, 47010 Kato Road, Fremont, California 94538 (United States)
Plasma discharge characteristics of a dc magnetron system were measured by a single Langmuir probe at the center axis of the dual-side process chamber. Plasma potential, floating potential, electron and ion densities, and electron temperature were extracted with varying dc power and gas pressure during sputter deposition of a metal target; strong correlations were shown between these plasma parameters and the sputter parameters. The electron density was controlled mostly by secondary electron generation in constant power mode, while plasma potential reflects the confinement space variation due to change of discharge voltage. When discharge pressure was varied, plasma density increases with the increased amount of free stock molecules, while electron temperature inversely decreased, due to energy-loss collision events. In low-pressure discharges, the electron energy distribution function measurements show more distinctive bi-Maxwellian distribution, with the fast electron temperature gradually decreases with increased gas pressure.
OSTI ID:
20719566
Journal Information:
Journal of Applied Physics, Journal Name: Journal of Applied Physics Journal Issue: 8 Vol. 98; ISSN JAPIAU; ISSN 0021-8979
Country of Publication:
United States
Language:
English

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