Low temperature, fast deposition of metallic titanium nitride films using plasma activated reactive evaporation
Journal Article
·
· Journal of Vacuum Science and Technology. A, Vacuum, Surfaces and Films
- ICMCB, CNRS-University of Bordeaux 1, F-33608 Pessac (France)
Titanium and titanium nitride thin films were deposited on silica glass and W substrates at a high coating growth rate by plasma-activated reactive evaporation (ARE). The crystal structure, preferred orientation and grain size of the coatings were determined by x-ray diffraction (XRD) technique using Cu-K{alpha} x rays. The analysis of the coating morphology was performed by field-emission scanning electron microscopy (FE-SEM). The composition of the films was analyzed by Auger electron spectroscopy (AES) and electron-probe microanalysis (EPMA). The titanium and titanium nitride condensates were collected on a carbon-coated collodion film then characterized by transmission electron microscopy (TEM) in order to study the structures of the deposits at very short deposition times. The resistivity of the films was measured by using the four-point-probe method. The titanium coatings were found to consist of very fine particles (40 nm in grain size) and to exhibit a strong (002) texture. The titanium nitride coatings were substoichiometric (TiN{sub x},x<1), with an oxygen content ranging from 7 to 15 at. % depending on the deposition conditions. The deposits were found to exhibit a (111) preferred orientation. This behavior became stronger with coating thickness. In spite of the presence of oxygen, all the TiN{sub x} coatings obtained at low temperature and a high growth rate in this work exhibited a rather high electrical conductivity.
- OSTI ID:
- 20637084
- Journal Information:
- Journal of Vacuum Science and Technology. A, Vacuum, Surfaces and Films, Journal Name: Journal of Vacuum Science and Technology. A, Vacuum, Surfaces and Films Journal Issue: 3 Vol. 23; ISSN 0734-2101; ISSN JVTAD6
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
75 CONDENSED MATTER PHYSICS
SUPERCONDUCTIVITY AND SUPERFLUIDITY
AUGER ELECTRON SPECTROSCOPY
CARBON
COATINGS
CRYSTAL STRUCTURE
ELECTRIC CONDUCTIVITY
ELECTRON MICROPROBE ANALYSIS
FIELD EMISSION
GLASS
GRAIN ORIENTATION
GRAIN SIZE
MORPHOLOGY
NITROCELLULOSE
PLASMA
SCANNING ELECTRON MICROSCOPY
TEMPERATURE RANGE 0065-0273 K
THIN FILMS
TITANIUM
TITANIUM NITRIDES
TRANSMISSION ELECTRON MICROSCOPY
X-RAY DIFFRACTION
SUPERCONDUCTIVITY AND SUPERFLUIDITY
AUGER ELECTRON SPECTROSCOPY
CARBON
COATINGS
CRYSTAL STRUCTURE
ELECTRIC CONDUCTIVITY
ELECTRON MICROPROBE ANALYSIS
FIELD EMISSION
GLASS
GRAIN ORIENTATION
GRAIN SIZE
MORPHOLOGY
NITROCELLULOSE
PLASMA
SCANNING ELECTRON MICROSCOPY
TEMPERATURE RANGE 0065-0273 K
THIN FILMS
TITANIUM
TITANIUM NITRIDES
TRANSMISSION ELECTRON MICROSCOPY
X-RAY DIFFRACTION