Microstructure and hardness of hollow cathode discharge ion-plated titanium nitride film

Journal Article · Mon Jun 01 04:00:00 EDT 1998 · Journal of Materials Engineering and Performance

DOI:https://doi.org/10.1361/105994998770347756· OSTI ID:634627

Chen, C T; Song, Y C; Yu, G P; Huang, J H ^[1]

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1. National Tsing Hua Univ., Hsinchu (Taiwan, Province of China). Dept. of Engineering and System Science

Titanium nitride (TiN) films were deposited on 304 stainless steel substrate by hollow cathode discharge (HCD) ion-plating technique. The preferred orientation and microstructure were studied by x-ray diffraction (XRD) and transmission electron microscopy (TEM), respectively. Microhardness of the TiN film was measured and correlated to the microstructure and preferred orientation. The results of TEM study showed that the microstructure of TiN film contains grains with nanometer scale. As the film thickness increases, the grain size of TiN increases. The x-ray results show that TiN(111) is the major preferred orientation of the film. The hardness of TiN film is primarily contributed from TiN(111) preferred orientation.

• OSTI ID: 634627
• Journal Information: Journal of Materials Engineering and Performance, Journal Name: Journal of Materials Engineering and Performance Journal Issue: 3 Vol. 7; ISSN 1059-9495; ISSN JMEPEG
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
GRAIN ORIENTATION
GRAIN SIZE
MICROHARDNESS
MICROSTRUCTURE
STAINLESS STEEL-304
SUBSTRATES
THIN FILMS
TITANIUM NITRIDES
X-RAY DIFFRACTION