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Preparing Pb(Zr,Ti)O{sub 3} films less than 100 nm thick by low-temperature metalorganic chemical vapor deposition

Journal Article · · Applied Physics Letters
DOI:https://doi.org/10.1063/1.1899770· OSTI ID:20637075
; ; ; ;  [1]
  1. Department of Innovative and Engineered Materials, Interdisciplinary Graduate School of Science and Engineering, Tokyo Institute of Technology, G1-32, 4259 Nagatsuta-cho, Midori-ku, Yokohama 226-8502 (Japan)
Polycrystalline Pb(Zr,Ti)O{sub 3} (PZT) films 70-80 nm thick on (111)Ir/TiO{sub 2}/SiO{sub 2}/Si substrates were prepared at 415 deg. C by metalorganic chemical vapor deposition (MOCVD). At 3 V, the remanent polarization (P{sub r}) of the as-deposited films was approximately 22 {mu}C/cm{sup 2}. Inserting PbTiO{sub 3} seeds between the PZT films and Ir bottom electrodes improved the crystallinity of the films markedly but improved their ferroelectric properties only slightly. Low-temperature postannealing, on the other hand, even at 400 deg. C (i.e., below the deposition temperature), improved P{sub r} values and hysteresis loop shapes without obviously improving the crystallinity of the films. The electrical properties were improved even more when the films were annealed at 500 deg. C. These results suggest that the low-temperature processing and sub-100-nm film thickness needed for making three-dimensionally structured ferroelectric capacitors can be obtained by using low-temperature MOCVD to deposit PZT films, and then annealing those films at a temperature no greater than 500 deg. C.
OSTI ID:
20637075
Journal Information:
Applied Physics Letters, Journal Name: Applied Physics Letters Journal Issue: 14 Vol. 86; ISSN APPLAB; ISSN 0003-6951
Country of Publication:
United States
Language:
English