Ring-field EUVL camera with large Etendu
A ``debris-less`` laser-plasma source (LPS) of extreme-UV radiation has been developed by Kubiak, et al. This is a huge step forward for the extreme-UV lithography program (EUVL) because it will extend the life of the collecting mirrors that face the source. This source has a 300-{mu}m diameter (D source) which is larger than the earlier, {approximately}75-{mu}m diameter plasma balls created on metal targets. The larger source size requires that the Etendu of the system must also be larger if the source radiation is to be used efficiently. A family of 4-mirror, scanning, ring-field lithography cameras has been designed that can be efficiently coupled to a ``debris-less`` LPS. The most promising design has a 0.085-numerical aperture (NA{sub camera}) for printing {approx} 100-nm features. At the image plane it has 13 nm of distortion and a 98% Strehl ratio across its 7-mm wide ring-field ({Delta}r).
- Research Organization:
- Sandia National Labs., Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 202424
- Report Number(s):
- SAND--95-2936C; CONF-960465--1; ON: DE96004677
- Country of Publication:
- United States
- Language:
- English
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