An evaluation of the partial transient liquid phase bonding of Si{sub 3}N{sub 4} using Au coated Ni-22Cr foils
- CEC, Petten (Netherlands). Inst. for Advanced Materials
- Univ. of California, Berkeley, CA (United States). Dept. of Materials Science and Mineral Engineering
The application of the partial transient liquid phase bonding (PTLPB) process for joining silicon nitride ceramics using microdesigned Au/Ni-Cr/Au multilayer interlayers has been investigated. The influence of different bonding parameters, such as time, temperature and interlayer thickness, on the microstructure and chemistry of the ceramic-metal interfaces has been studied. Scanning electron microscopy and electron probe microanalysis investigations revealed that the ceramics were bonded to the Ni-Cr foils by a thin CrN reaction product layer while the Au had alloyed to form a Ni rich solid solution. Joints with room temperature average flexural strength of 272 MPa, were produced under optimized bonding conditions of 4 h at 1,000 C. These processing conditions resulted in joints with microstructure and strength equivalent to those obtained by optimized diffusion bonding procedures. The effect of post-bonding annealing in air at 800 C for 60 h on the room temperature joint strength was also assessed.
- OSTI ID:
- 201078
- Journal Information:
- Acta Materialia, Journal Name: Acta Materialia Journal Issue: 2 Vol. 44; ISSN XZ504Y; ISSN 1359-6454
- Country of Publication:
- United States
- Language:
- English
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