Transient liquid phase bonding of silicon ceramics via microdesigned NI-based interlayers
- Univ. of California, Berkeley, CA (United States)
Ceramic-ceramic joining of silicon nitride and silicon carbide ceramics has been achieved by exploiting a multilayer metallic interlayer designed to form a thin layer of a transient liquid phase. Au-Cu/Ni/Au-Cu interlayers have been used to form Si{sub 3}N{sub 4}/Ni/Si{sub 3}N{sub 4} and SiC/Ni/SiC bonds at 950{degrees}C. In both cases, the maximum four-point flexure strengths approach those of the parent ceramic, consistent with observations of exclusively ceramic failure. The average room temperature bend strength of joined Si{sub 3}N{sub 4} assemblies was 770 MPa, while that for the joined SiC assemblies was 260 MPa. Results of fractographic and chemical analyses are used as a basis for discussing aspects of processing and mechanical properties.
- DOE Contract Number:
- AC03-76SF00098
- OSTI ID:
- 96563
- Report Number(s):
- CONF-940416--
- Country of Publication:
- United States
- Language:
- English
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