Sliding of copper [001]-twist grain boundaries detected by shear deformation of liquid B{sub 2}O{sub 3} particles on the grain boundaries
From a Cu-0.065mass%B solid solution alloy, bicrystals having [001]-twist grain boundaries with various misorientation angles were prepared by the Bridgman method. Cu bicrystals containing B{sub 2}O{sub 3} particles were made from the bicrystals by internal oxidation treatment. The Cu-B{sub 2}O{sub 3} bicrystals were tensile tested at high temperatures, where B{sub 2}O{sub 3} particles become liquid. The amount of grain-boundary sliding was measured from the amount of shear deformation of the liquid B{sub 2}O{sub 3} particles on a sliding grain boundary. Shear deformation of voids where the B{sub 2}O{sub 3} particles was embedded was also utilized to measure the amount of grain-boundary sliding. The temperature and misorientation-angle dependence of the grain-boundary sliding is discussed for the Cu-B{sub 2}O{sub 3} bicrystals. Since the liquid B{sub 2}O{sub 3} particles easily deform at high temperatures, the measured amount of grain-boundary sliding is considered to reflect the inherent nature of the Cu [001]-twist grain boundaries. Using the present method of measurements, up to 2 {micro}m grain-boundary sliding can be measured with an accuracy of about 0.1 {micro}m.
- Research Organization:
- Univ. of Electro-Communications, Tokyo (JP)
- OSTI ID:
- 20075947
- Journal Information:
- Acta Materialia, Vol. 48, Issue 8; Other Information: PBD: 11 May 2000; ISSN 1359-6454
- Country of Publication:
- United States
- Language:
- English
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