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Title: Sliding of copper [001]-twist grain boundaries detected by shear deformation of liquid B{sub 2}O{sub 3} particles on the grain boundaries

Abstract

From a Cu-0.065mass%B solid solution alloy, bicrystals having [001]-twist grain boundaries with various misorientation angles were prepared by the Bridgman method. Cu bicrystals containing B{sub 2}O{sub 3} particles were made from the bicrystals by internal oxidation treatment. The Cu-B{sub 2}O{sub 3} bicrystals were tensile tested at high temperatures, where B{sub 2}O{sub 3} particles become liquid. The amount of grain-boundary sliding was measured from the amount of shear deformation of the liquid B{sub 2}O{sub 3} particles on a sliding grain boundary. Shear deformation of voids where the B{sub 2}O{sub 3} particles was embedded was also utilized to measure the amount of grain-boundary sliding. The temperature and misorientation-angle dependence of the grain-boundary sliding is discussed for the Cu-B{sub 2}O{sub 3} bicrystals. Since the liquid B{sub 2}O{sub 3} particles easily deform at high temperatures, the measured amount of grain-boundary sliding is considered to reflect the inherent nature of the Cu [001]-twist grain boundaries. Using the present method of measurements, up to 2 {micro}m grain-boundary sliding can be measured with an accuracy of about 0.1 {micro}m.

Authors:
; ; ; ;
Publication Date:
Research Org.:
Univ. of Electro-Communications, Tokyo (JP)
OSTI Identifier:
20075947
Resource Type:
Journal Article
Journal Name:
Acta Materialia
Additional Journal Information:
Journal Volume: 48; Journal Issue: 8; Other Information: PBD: 11 May 2000; Journal ID: ISSN 1359-6454
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; GRAIN BOUNDARIES; TENSILE PROPERTIES; COPPER; BORON ADDITIONS; OXIDATION; TEMPERATURE DEPENDENCE; PARTICLES; LIQUIDS

Citation Formats

Miura, H., Sakai, T., Otsuka, T., Monzen, R., and Onaka, S. Sliding of copper [001]-twist grain boundaries detected by shear deformation of liquid B{sub 2}O{sub 3} particles on the grain boundaries. United States: N. p., 2000. Web. doi:10.1016/S1359-6454(99)00467-X.
Miura, H., Sakai, T., Otsuka, T., Monzen, R., & Onaka, S. Sliding of copper [001]-twist grain boundaries detected by shear deformation of liquid B{sub 2}O{sub 3} particles on the grain boundaries. United States. doi:10.1016/S1359-6454(99)00467-X.
Miura, H., Sakai, T., Otsuka, T., Monzen, R., and Onaka, S. Thu . "Sliding of copper [001]-twist grain boundaries detected by shear deformation of liquid B{sub 2}O{sub 3} particles on the grain boundaries". United States. doi:10.1016/S1359-6454(99)00467-X.
@article{osti_20075947,
title = {Sliding of copper [001]-twist grain boundaries detected by shear deformation of liquid B{sub 2}O{sub 3} particles on the grain boundaries},
author = {Miura, H. and Sakai, T. and Otsuka, T. and Monzen, R. and Onaka, S.},
abstractNote = {From a Cu-0.065mass%B solid solution alloy, bicrystals having [001]-twist grain boundaries with various misorientation angles were prepared by the Bridgman method. Cu bicrystals containing B{sub 2}O{sub 3} particles were made from the bicrystals by internal oxidation treatment. The Cu-B{sub 2}O{sub 3} bicrystals were tensile tested at high temperatures, where B{sub 2}O{sub 3} particles become liquid. The amount of grain-boundary sliding was measured from the amount of shear deformation of the liquid B{sub 2}O{sub 3} particles on a sliding grain boundary. Shear deformation of voids where the B{sub 2}O{sub 3} particles was embedded was also utilized to measure the amount of grain-boundary sliding. The temperature and misorientation-angle dependence of the grain-boundary sliding is discussed for the Cu-B{sub 2}O{sub 3} bicrystals. Since the liquid B{sub 2}O{sub 3} particles easily deform at high temperatures, the measured amount of grain-boundary sliding is considered to reflect the inherent nature of the Cu [001]-twist grain boundaries. Using the present method of measurements, up to 2 {micro}m grain-boundary sliding can be measured with an accuracy of about 0.1 {micro}m.},
doi = {10.1016/S1359-6454(99)00467-X},
journal = {Acta Materialia},
issn = {1359-6454},
number = 8,
volume = 48,
place = {United States},
year = {2000},
month = {5}
}