Temperature dependence of ductility and fracture of Cu-SiO[sub 2] bicrystals with [001] twist boundaries
- Univ. of Electro-Communications, Tokyo (Japan). Dept. of Mechanical and Control Engineering
- Tokyo Inst. of Tech. (Japan). Dept. of Materials Science and Engineering
Cu-SiO[sub 2] bicrystals having [001] twist boundaries with different misorientation angles were tensile tested at various temperatures from 473 to 1,023 K to investigate their deformation and fracture behavior. These bicrystals have dispersed SiO[sub 2] particles both in grains and on grain boundaries. Most bicrystals fractured intergranularly. As the misorientation angle increases, intergranular brittle fracture took place more easily at lower temperatures and the recovery of ductility at high temperatures became more difficult. Bicrystals with low-angle boundaries showed clear intermediate-temperature embrittlement with ductility minima at about 770 K. These grain boundary dependent characteristics of deformation and fracture behavior of bicrystals could be explained reasonably by considering the difference in the occurrence of grain boundary sliding and of relaxation by diffusion along the particle/matrix interfaces.
- OSTI ID:
- 6237674
- Journal Information:
- Acta Metallurgica et Materialia; (United States), Journal Name: Acta Metallurgica et Materialia; (United States) Vol. 41:4; ISSN 0956-7151; ISSN AMATEB
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
360603* -- Materials-- Properties
ALLOYS
CHALCOGENIDES
COPPER ALLOYS
DEFORMATION
DUCTILITY
EMBRITTLEMENT
FRACTURE PROPERTIES
GRAIN BOUNDARIES
MECHANICAL PROPERTIES
MICROSTRUCTURE
OXIDES
OXYGEN COMPOUNDS
RELAXATION
SILICON COMPOUNDS
SILICON OXIDES
TEMPERATURE DEPENDENCE
TEMPERATURE RANGE
TEMPERATURE RANGE 0400-1000 K
TEMPERATURE RANGE 1000-4000 K
TENSILE PROPERTIES