Inductively Coupled Plasma Etching in ICl- and IBr-Based Chemistries: Part I. GaAs, GaSb and AlGaAs
- Sandia National Laboratories
High density plasma etching of GaAs, GaSb and AIGaAs was performed in IC1/Ar and lBr/Ar chemistries using an Inductively Coupled Plasma (ICP) source. GaSb and AlGaAs showed maxima in their etch rates for both plasma chemistries as a function of interhalogen percentage, while GaAs showed increased etch rates with plasma composition in both chemistries. Etch rates of all materials increased substantially with increasing rf chuck power, but rapidly decreased with chamber pressure. Selectivities > 10 for GaAs and GaSb over AlGaAs were obtained in both chemistries. The etched surfaces of GaAs showed smooth morphology, which were somewhat better with IC1/Ar than with IBr/& discharge. Auger Electron Spectroscopy analysis revealed equi-rate of removal of group III and V components or the corresponding etch products, maintaining the stoichiometry of the etched surface.
- Research Organization:
- Sandia National Laboratories, Albuquerque, NM, and Livermore, CA
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 1960
- Report Number(s):
- SAND98-2614J; ON: DE00001960
- Journal Information:
- Plasma Chemistries and Plasma Processes, Journal Name: Plasma Chemistries and Plasma Processes
- Country of Publication:
- United States
- Language:
- English
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