Aerosol-assisted chemical vapor deposition (AACVD) of binary alloy (Ag{sub x}Pd{sub 1-x}, Cu{sub x}Pd{sub 1-x}, Ag{sub x}Cu{sub 1-x}) films and studies of their compositional variation
- Univ. of New Mexico, Albuquerque, NM (United States)
Atmospheric pressure chemical vapor deposition (CVD) of Ag-Pd,Cu-Pd, and Ag-Cu alloys using aerosol precursor delivery over a range of preheating temperatures, 70-80{degrees}C and substrate temperatures, 250-300{degrees}C is described. The precursors were (hfac)Ag(SEt{sub 2}), (hfac)Cu{sup I}(1,5-COD), Cu(hfac){sub 2}, Pd(hfac){sub 2}, and Pd(hfac){sub 2}(SE5{sub 2}) dissolved in toluene with 10% H{sub 2} in Ar as carrier gas. The films were characterized by scanning electron microscopy (SEM), energy-dispersive spectroscopy (EDS), and X-ray diffraction. The X-ray diffraction results showed the Ag PD films consisted of AgNO{sub 3} and volatile (hfac)Ag(SEt{sub 2}) as precursors to Ag films were consistent with a chemical vapor deposition (CVD) process. Reactivity studies between precursors and H{sub 2} suggested Pd(hfac){sub 2} is likely to undergo a small amount (<2%) of decomposition during the aerosol-assisted CVD experiments, and Pd(hfac){sub 2}(SEt{sub 2})/Pd(hfac){sub 2{minus}}(SEt{sub 2}) in different ratios in toluene solution. The films were characterized by X-ray diffraction and the results showed the composition of the films was dependent upon the solution stoichiometry. The possible rate-limiting steps are discussed, and it is proposed that the deposition rate is limited by the feed rate of the precursors to the reactor. These predictions were consistent with a study of deposition rate as a function of substrate temperature at constant feed rate in the (hfac)Ag(SEt{sub 2})/Pd(hfac){sub 2}(SEt{sub 2}) system, which showed no variation in the deposition rate over a 75{degrees}C temperature range. It was concluded that conditions of feed-rate or diffusion-rate limited deposition are useful approaches to control film composition. 42 refs., 12 figs., 1 tab.
- Sponsoring Organization:
- USDOE
- OSTI ID:
- 191879
- Journal Information:
- Chemistry of Materials, Journal Name: Chemistry of Materials Journal Issue: 8 Vol. 7; ISSN CMATEX; ISSN 0897-4756
- Country of Publication:
- United States
- Language:
- English
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