Hybrid chip-on-board LED module with patterned encapsulation

Patent · Tue Jul 27 04:00:00 EDT 2021

OSTI ID:1840298

Soer, Wouter Anthon; Helbing, Rene; Huang, Guan

Light modules and methods of forming light modules are disclosed. A light module includes a first plurality and a second plurality of light emitting elements configured to emit, respectively, a first light and a second light, and both arranged on a substrate. An encapsulation layer is disposed over the first and second plurality of the light emitting elements, and a wavelength converting element is dispersed in the encapsulation layer. A concentration of the wavelength converting element in the encapsulation layer varies, is larger over the first plurality of light emitting elements and is smaller over the second plurality of light emitting elements.

• Research Organization: Lumileds LLC, San Jose, CA (United States)
• Sponsoring Organization: USDOE
• DOE Contract Number: EE0005099
• Assignee: Lumileds LLC (San Jose, CA)
• Patent Number(s): 11,075,327
• Application Number: 16/690,837
• OSTI ID: 1840298
• Country of Publication: United States
• Language: English