Hybrid chip-on-board LED module with patterned encapsulation
Different wavelength conversion materials, or different concentrations of a wavelength conversion material are used to encapsulate the light emitting elements of different colors of a hybrid light emitting module. In an embodiment of this invention, second light emitting elements (170) of a particular color are encapsulated with a transparent second encapsulant (120;420;520), while first light emitting elements (160) of a different color are encapsulated with a wavelength conversion first encapsulant (110;410;510). In another embodiment of this invention, a particular second set of second and third light emitting elements (170,580) of different colors is encapsulated with a different encapsulant than another first set of first light emitting elements (160).
- Research Organization:
- Lumileds LLC, San Jose, CA (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- EE0005099
- Assignee:
- Lumileds LLC (San Jose, CA)
- Patent Number(s):
- 9,905,737
- Application Number:
- PCT/IB2014/064070
- OSTI ID:
- 1423437
- Country of Publication:
- United States
- Language:
- English
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