Hybrid chip-on-board LED module with patterned encapsulation
Patent
·
OSTI ID:1600332
Different wavelength conversion materials, or different concentrations of a wavelength conversion material are used to encapsulate the light emitting elements of different colors of a hybrid light emitting module. In an embodiment of this invention, the light emitting elements of a particular color are encapsulated with a transparent encapsulant, while the light emitting elements of a different color are encapsulated with a wavelength conversion encapsulant. In another embodiment of this invention, a particular set of light emitting elements of different colors is encapsulated with a different encapsulant than another set of light emitting elements.
- Research Organization:
- Lumileds LLC, San Jose, CA (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- EE0005099
- Assignee:
- Lumileds LLC (San Jose, CA)
- Patent Number(s):
- 10,490,710
- Application Number:
- 15/887,603
- OSTI ID:
- 1600332
- Country of Publication:
- United States
- Language:
- English
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