Thermal effects of an advanced wire mesh packaging material
- Gram, Inc., Albuquerque, NM (United States)
- Sandia National Labs., Albuquerque, NM (United States)
Short communication.
- Research Organization:
- Sandia National Labs., Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 167154
- Report Number(s):
- SAND--95-3020C; CONF-951203--29; ON: DE96003768
- Country of Publication:
- United States
- Language:
- English
Similar Records
Advances in MOVPE compound semiconductor epitaxy manufacturing technology: From high throughput large area reactors to cluster tools
Toward low-cost display assembly and packaging: Precompetitive challenges
Initial Temperature Testing of Advanced Manufactured Melt Wire Package
Technical Report
·
Thu Dec 30 23:00:00 EST 1993
·
OSTI ID:10120696
Toward low-cost display assembly and packaging: Precompetitive challenges
Technical Report
·
Sun Aug 01 00:00:00 EDT 1993
·
OSTI ID:10184550
Initial Temperature Testing of Advanced Manufactured Melt Wire Package
Technical Report
·
Sat Feb 29 23:00:00 EST 2020
·
OSTI ID:1826597