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Toward low-cost display assembly and packaging: Precompetitive challenges

Technical Report ·
DOI:https://doi.org/10.2172/10184550· OSTI ID:10184550
 [1];  [2]
  1. Sandia National Labs., Albuquerque, NM (United States)
  2. Xerox Palo Alto Research Center, CA (United States)
+ Show Author Affiliations

Short communication.

Research Organization:
Sandia National Labs., Albuquerque, NM (United States)
Sponsoring Organization:
USDOE, Washington, DC (United States)
DOE Contract Number:
AC04-76DP00789
OSTI ID:
10184550
Report Number(s):
SAND--93-1626C; CONF-931192--1; ON: DE93018850
Country of Publication:
United States
Language:
English

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Related Subjects

42 ENGINEERING
426000
BONDING
COMPONENTS
ELECTRON DEVICES AND CIRCUITS
CONTAMINATION
DISPLAY DEVICES
FABRICATION
INTEGRATED CIRCUITS
PACKAGING
PROCESS CONTROL
RELIABILITY
SEALS