High accuracy die mechanical stress measurement with the ATC04 Assembly Test Chip
Short communication.
- Research Organization:
- Sandia National Labs., Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC04-76DP00789
- OSTI ID:
- 10181996
- Report Number(s):
- SAND--93-1837C; CONF-9310147--1; ON: DE93019435
- Country of Publication:
- United States
- Language:
- English
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