Formation of Ohmic Contacts to n-GaAs at Temperatures Compatible with Indium Flip-Chip Bonding.
Conference
·
OSTI ID:1639867
Abstract not provided.
- Research Organization:
- Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE National Nuclear Security Administration (NNSA)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 1639867
- Report Number(s):
- SAND2019-4576C; 674951
- Country of Publication:
- United States
- Language:
- English
Similar Records
Formation of Ohmic Contacts to n-GaAs at Temperatures Compatible with Indium Flip-Chip Bonding.
Indium electrodeposition for finer and denser features flip chip arrays.
Thin Gold to Gold Bonding for Flip Chip Applications.
Conference
·
Tue Oct 01 00:00:00 EDT 2019
·
OSTI ID:1642903
Indium electrodeposition for finer and denser features flip chip arrays.
Conference
·
Sun Aug 01 00:00:00 EDT 2010
·
OSTI ID:1122520
Thin Gold to Gold Bonding for Flip Chip Applications.
Conference
·
Mon Jan 31 23:00:00 EST 2011
·
OSTI ID:1120610