Skip to main content
OSTI.GOVU.S. Department of Energy Office of Scientific and Technical Information
U.S. Department of Energy
Office of Scientific and Technical Information
 

Indium electrodeposition for finer and denser features flip chip arrays.

Conference ·
OSTI ID:1122520
; ; ; ; ; ; ; ;

Abstract not provided.

Research Organization:
Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States); Sandia National Laboratories, Livermore, CA
Sponsoring Organization:
USDOE National Nuclear Security Administration (NNSA)
DOE Contract Number:
AC04-94AL85000
OSTI ID:
1122520
Report Number(s):
SAND2010-5787C; 491713
Country of Publication:
United States
Language:
English

Similar Records

Formation of Ohmic Contacts to n-GaAs at Temperatures Compatible with Indium Flip-Chip Bonding.
Conference · Tue Oct 01 00:00:00 EDT 2019 · OSTI ID:1642903
Formation of Ohmic Contacts to n-GaAs at Temperatures Compatible with Indium Flip-Chip Bonding.
Conference · Mon Apr 01 00:00:00 EDT 2019 · OSTI ID:1639867
Flip-Chip and Backside Techniques.
Conference · Wed Aug 01 00:00:00 EDT 2018 · OSTI ID:1581915

Related Subjects